An engineer must be proficient in the capabilities of the technological process based on which the board will be manufactured. Compliance with technological standards at the design phase of a printed circuit board ensures its subsequent high-quality and reliable production, enables high volumes to be produced by minimizing defects, and also ensures the reliable functioning of the devices where the PCB is used. The above allows to reduce cost on both the product introduction phase and its operational phase.
| Description | Typical | Advanced |
| Single-sided PCB | ||
| Min Trace, mm | 0.2 | 0.15 |
| Min spacing, mm | 0.2 | 0.15 |
| Trace to board edge distance, mm | 0.5 (V-cut) | 0.25 (routing) |
| Min drill hole size, mm | 0.5 | 0.3 |
| Minimum annular ring, mm | 0.3 | 0.2 |
| Solder mask opening/expansion, mm | 0.1 | 0.05 |
| Solder bridge, mm | 0.15 | 0.1 |
| Min width of marking line, mm | 0.15 | 0.15 |
| Min height of marking text, mm | 1 | 0.8 |
| Double-sided PCB | ||
| Min Trace, mm | 0.15 | 0.1 |
| Min spacing, mm | 0.15 | 0.1 |
| Trace to board edge distance, mm | 0.5 (V-cut) | 0.25 (routing) |
| Min drill hole size, mm | 0.3 | 0.2 |
| Limit aspect ratio of hole diameter to board thickness, mm | 1:8 | 1:12 |
| Minimum annular ring, mm | 0.2 | 0.15 |
| Solder mask opening/expansion, mm | 0.1 | 0.05 |
| Solder bridge, mm | 0.2 | 0.1 |
| Min width of marking line, mm | 0.15 | 0.15 |
| Min height of marking text, mm | 1 | 0.8 |
| Multi-layer PCB | ||
| Number of layers | 4-14 | 4-28 |
| Min Trace, mm | 0.1 | 0.075 |
| Min spacing, mm | 0.1 | 0.075 |
| Trace to board edge distance (outer/inner layers), mm | 0.5 / 0.5 (V-cut) | 0.25 / 0.3 (routing) |
| Min drill hole size, mm | 0.2 | 0.15 |
| Limit aspect ratio of hole diameter to board thickness, mm | 1:8 | 1:12 |
| Minimum annular ring, mm | 0.15 | 0.1 (0.05 for laser MicroVia) |
| Buried (hidden) holes | yes | yes |
| Blind holes | yes | yes |
| Solder mask opening/expansion, mm | 0.05 | 0.05 |
| Solder bridge, mm | 0.1 | 0.1 |
| Min width of marking line, mm | 0.15 | 0.1 |
| Min height of marking text, mm | 1 | 0.8 |
| Multi-layer HDI PCB | ||
| Number of layers | 4-16 | 4-28 |
| Min Trace, mm | 0.1 | 0.075 |
| Min spacing, mm | 0.1 / 0.075 | 0.075 / 0.075 |
| Trace to board edge distance (outer/inner layers), mm | 0.5 / 0.5 (V-cut) | 0.25 / 0.4 (routing) |
| Min laser hole size, mm | 0.1 | 0.075 |
| Min drill hole size, mm | 0.2 | 0.15 |
| Minimum annular ring (outer/inner layers), mm | 0.15 / 0.1 | 0.127 / 0.1 |
| Via-in-Pad technology | yes | yes |
| Buried (hidden) holes | yes | yes |
| Blind holes | yes | yes |
| Stacked and staggered microvias | yes | yes |
| Solder mask opening/ expansion, mm | 0.05 | 0.05 |
| Solder bridge, mm | 0.1 | 0.1 |
| Min width of marking line, mm | 0.15 | 0.15 |
| Min height of marking text, mm | 1 | 0.8 |
| Flexible PCB | ||
| Number of layers | 1 | |
| Material | Polyimide, PET | |
| Min Trace, mm | 0.15 | 0.1 |
| Min spacing, mm | 0.15 | 0.1 |
| Trace to board edge distance, mm | 0.5 | 0.25 |
| Min drill hole size, mm | 0.3 | 0.2 |
| Solder mask (coverlay) opening/expansion, mm | 0.15 | 0.15 |
| Possibility of manufacturing a stiffener for flex PCB | Yes (Polyimide or FR4)6 | |
| Rigid flex PCB | ||
| Number of layers | 4-16 | 4-28 |
| Min Trace, mm | 0.1 | 0.075 |
| Min spacing, mm | 0.1 | 0.075 |
| Trace to board edge distance (outer/inner layers), mm | 0.5 / 0.5 (V-cut) | 0.25 / 0.4 (routing) |
| Min drill hole size, mm | 0.25 | 0.2 |
| Minimum annular ring (outer/inner layers), mm | 0.15 / 1 | 0.127 / 0.1 |
| Via-in-Pad technology | yes | yes |
| Buried (hidden) holes (rigid part) | yes | yes |
| Blind holes (rigid part) | yes | yes |
| Solder mask (coverlay) opening/ expansion, mm | 0.05 / 0.15 | 0.05 / 0.15 |
| Solder bridge, mm | 0.1 / 0.2 | 0.1 / 0.2 |
| Min width of marking line, mm | 0.15 | 0.15 |
| Min height of marking text, mm | 1 | 0.8 |
| Possibility of manufacturing a stiffener for flex PCB | Yes (Polyimide or FR4)6 | |
| Aluminum based PCB | ||
| Number of layers | 1-2 | 1-4 |
| Board Thickness, mm | 0.5 – 3.2 | |
| Copper thickness, μm | 35 | |
| Dielectric thickness, μm | 50, 75, 100, 150 | |
| Thermal conductivity, W/(m∙K) | 1-4 | |
| Dielectric strength, kV | 2-6 | |
| Max size, mm | 550.0 x 950.0 | |
| Min Trace, mm | 0.2 | 0.15 |
| Min spacing, mm | 0.2 | 0.15 |
| Trace to board edge distance, mm | 0.5 | 0.25 |
| Min drill hole size, mm | 0.9 | 0.6 |
| Solder bridge, mm | 0.1 | 0.05 |
1Final copper thickness depends on clearances (see “Minimum clearances for different copper thicknesses” table)
2Other materials upon request
3Other colors upon request
4Solder bridge is 0,15 mm
5Upon request
6Stiffener thickness upon request
Minimum clearances for different copper thicknesses
Outer layers
| Finish copper thickness | 35um | 70um | 105um | 140um | 210um |
| Min Trace | 0.1mm | 0.20mm | 0.23mm | 0.30mm | 0.60mm |
| Min clearance | 0.1mm | 0.20mm | 0.24mm | 0.35mm |
0.70mm |
Inner layers
| Finish copper thickness | 35um | 70um | 105um | 140um | 210um |
| Min Trace | 0.1mm | 0.20mm | 0.30mm | 0.45mm | 0.87mm |
| Min clearance | 0.1mm | 0.20mm | 0.27mm | 0.34mm | 0.58mm |
Standard copper via wall thickness is up to 20um.
Gold thickness in IG coating — 0.05-0.11um,
HardGold (GoldFingers) — 0.07-1.27um